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Assembly

With the Center for Bonding Technology and Assembly, commissioned in the year 2000, Boehringer Ingelheim microParts uses most modern production machines for mass production of microstructures and complete microsystems.

Center for Bonding Technology and Assembly

High-grade microsystems for the most varied interfaces

Different technologies - e.g. laminating, adhesive bonding, ultrasonic and laser welding, thermal bonding - allow precise, product-specific material bonding. Boehringer Ingelheim microParts has the know-how to develop microsystems with individually configurable interfaces which can be integrated without any problem into existing macroscopic systems. With many years of experience and creative and innovative spirit, application-optimized and cost-efficient problem solutions for customers are developed.

Surface modification

Bonding Technology and Assembly

Surface treatment of the microstructured plastic components guarantees important product properties for Lab-on-a-Chip systems, e.g. the controlled wetting ability with liquids. Surface modification comprises the three basic treatment stages: cleaning, surface activation and surface coating. Hydrophobic and hydrophilic surfaces, meaning water-repellent or easily wettable surfaces, can be set for defined regions of the component, depending on the requirements of the respective Lab-on-a-Chip system. These properties are extremely important for exact handling of bio-molecules and for fluidic control. Boehringer Ingelheim microParts has a wide spectrum of technologies for long-term stable surface treatment at its disposal, like plasma polymerization and wet chemical processes.

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